Shanghai, Nov 25, 2025 – KUKO presented its latest intelligent packaging equipment at SWOP 2025 held at Shanghai New International Expo Center (Booth N3E19) from Nov 25 to 27. As a leader in film wrapping and shrink packaging machinery, KUKO showcased high-speed, energy-efficient packaging solutions suitable for food, daily chemicals and pharmaceuticals, demonstrating its strengths in automated, green packaging.

As a benchmark packaging exhibition in Asia, SWOP gathers global industry innovations. KUKO’s team offered on-site demos and interactive experiences at the booth, aiming to connect with domestic and international partners, explore industry trends and enhance its global footprint.

"SWOP 2025 is key to KUKO’s global expansion," said Mr. Bi, head of KUKO. "We’re eager to showcase our innovative manufacturing capabilities, learn from global peers and create greater value for customers. We sincerely invite all industry participants to visit Booth N3E19 and witness KUKO’s technological innovations driving the industry forward!"